F32 Gold Full Modular PCIe 5.1
F32 (850W–1200W)Heavy-duty 850W to 1200W ATX 3.1 platform equipped with full-bridge LLC resonance and synchronous DC-DC conversion, delivering ≥90% efficiency, native PCIe 5.1 support, and comprehensive thermal OTP protection.
Product Specifications
Full breakdown (12 specs) ↓Platform overview
Designed around the brief.
Built to rigorous industrial standards with verified thermal dynamics, precision topology control, and high-efficiency power delivery engineered for heavy compute demands.
≥90%
80 PLUS Gold certified
≤50 µs
Fast recovery response
9-Fold
Hardware safety suite
>100k h
MTBF industrial rating
Custom wattage bins (550W–1050W), bespoke cable harness lengths, custom fan curves, and private label chassis grilles available for enterprise orders.
Inquire for custom platform specsNative PCIe 5.1 standard with high-power 12V-2x6 connector delivering up to 600W GPU power
Configuration and availability require confirmation for the final product program.
Full-bridge LLC resonant topology paired with DC-DC step-down converters for superior voltage stability
Configuration and availability require confirmation for the final product program.
Over-temperature protection (OTP) added to full 9-fold industrial protection suite
Configuration and availability require confirmation for the final product program.
90–264V full-range AC tolerance with low-voltage cold startup capability
Configuration and availability require confirmation for the final product program.
Intelligent temperature-controlled fan curve operating quietly at 900 RPM under typical workloads
Configuration and availability require confirmation for the final product program.
High power factor (>0.98) with SendustCore magnetic inductors minimizing reactive power loss
Configuration and availability require confirmation for the final product program.
Individual modular black flat cables allowing customizable routing and improved case thermodynamics
Configuration and availability require confirmation for the final product program.
Certified for high-TDP flagship processors from latest Intel and AMD desktop lines
Configuration and availability require confirmation for the final product program.
Architecture & Hardware Showcase
Precision engineering, inside and out.
Direct view into component selection, structural PCB layout, and thermal topology.
Chassis & Enclosure
Durable matte black / industrial enclosure designed for optimal ventilation and component protection.
Internal Architecture & Layout 1
Internal component layout showcasing filtration stage, transformer section, and precision manufacturing.
Internal Architecture & Layout 2
Internal component layout showcasing filtration stage, transformer section, and precision manufacturing.
Internal Architecture & Layout 3
Internal component layout showcasing filtration stage, transformer section, and precision manufacturing.
Structured data
Specifications
Engineered for high-wattage computing platforms, advanced multi-GPU systems, and enthusiast gaming rigs, the F32 platform features full-bridge LLC resonant architecture, SendustCore magnetic inductors, and native PCIe 5.1 12V-2x6 high-current delivery. The direct-soldered modular backplane reduces internal line resistance and provides ultra-clean chassis cabling.
F32 Gold Full Modular PCIe 5.1 Engineering Datasheet
PDF · Mechanical dimensions & pinouts
Manufacturing & Test Standards
- Chroma 8000 automated test validation
- 100% Hi-Pot & thermal burn-in tested
- Intel ATX 3.1 & PCIe 5.1 native certification
- Taiwan / Japanese 105°C primary capacitor tier
Need custom voltage tolerances, custom cable harnesses or compliance records? Contact our power engineering team →
- Rated output
- 850 W – 1200 W
- Efficiency tier
- 80 PLUS Gold (≥90% typical load)
- Topology
- Active PFC + Full-Bridge LLC + DC-DC
- Standard
- Intel ATX 3.1 / PCIe 5.1 Native
- AC input range
- 90 – 264 V (Full Range global input)
- Dynamic response
- ≤50 µs transient recovery time
- Power factor
- >0.98 (SendustCore PFC choke)
- Ripple & noise
- +5V/+3.3V <50mV, +12V <120mV
- Cooling fan
- 140 mm / 120 mm smart PWM (min 900 RPM)
- Modularity
- Full Modular black backplane
- Protection suite
- Brown-out, OVP, UVP, OCP, OTP, OPP, SCP, ESD, Surge, EMC
- MTBF
- >100,000 hours (Industrial grade)
PC Power Supply Engineering
PC Power Supply OEM/ODM & Technical Support
Direct technical & commercial access for desktop, gaming rig, and workstation power supplies. Discuss wattage sizing (550W–1050W), ATX 3.1 & 12V-2x6 GPU delivery, modular cabling, and PC chassis compatibility with our engineering team.
Direct FAE evaluation for GPU transient spikes (200% excursion), 12V-2x6 cable clearance, and motherboard 24-pin compatibility within 24 hours.
Golden engineering units shipped in 3–5 days to validate PC chassis mounting, FDB fan acoustic profiles, and GPU power delivery under real loads.
Custom embossed/braided modular cables, customized casing finishes (Black/White), branded fan grilles, and bilateral NDA protection.
Complete ATE automated test reports (ripple <30mV, voltage regulation <±1.5%), cross-load efficiency curves, thermal imaging, and 3D CAD STEP files.
PC Power Supply Project Roadmap
- 1Platform & Wattage Selection: Choose standard wattage (550W–1050W), modular format (Full/Semi/Direct), or custom embossed cable lengths.
- 2Chassis & GPU Compatibility Review (<24h): Our FAEs verify 140mm chassis depth fitment, 12V-2x6 thermal safety, and thermal airflow curves.
- 3EVT Prototype & Bench Test: Receive working samples for system smoke test & motherboard validation, followed by mass production.
For urgent PC system integration, gaming rig bids, or high-volume PSU orders, contact our power supply engineering team via larry@encon.ltd for immediate assistance.
Downloads
Formal product documents are not yet available.
Ask ENCON for the latest approved datasheet or certification document.